Packaging Engineering Intern

About the Company

fab2 is an early-stage hardware startup founded by Sam Zeloof and Jim Keller. The team designs and builds all the hardware and software needed to make chips, including the fabs, tools, and components themselves.

Responsibilities

• Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
• Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
• Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
• Hands-on package/wafer processing including 3d printing, metal plating, lithography, and metrology

Requirements

• Pursuing a Bachelor’s Degree or higher in engineering
• At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating or device fabrication
• Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection)
• Hands-on prototyping experience and ability to move through design cycles quickly
• A portfolio of built projects is required to apply

Preferred Qualifications

• Proven experience in mechatronics or electromechanical system design
• Familiarity with lasering and 3D printing (stereolithography)
• Reliability testing, soldering, and reflow testing
• Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray)

Benefits

• Housing Stipend
• Daily lunches and dinners 3x per week
• Weekly Learning & Development opportunities
• Commuter Benefits including Parking and Late Night Uber rides
• Paid Time Off inclusive of Holidays and Sick Time
• Visa Sponsorship
• Medical, Dental, and Vision insurance
• 401(k) retirement plan
• Life and Disability Insurance