Packaging Engineer

Responsibilities

• Define, develop, and qualify new wire bonded and flip chip semiconductor packages with subcontractors
• Maintain quality of existing packages
• Manage next generation packaging technologies with internal R&D teams and external technology partners
• Collaborate with business units to understand future product needs and suggest packaging solutions
• Drive yield improvement and subcontractor operational efficiency
• Manage the entire package life cycle from path finding to qualification and HVM

Requirements

• Master's degree in Electrical Engineering, Chemical Engineering, Material Science, Physics, or a related engineering discipline
• Excellent communication and interpersonal skills
• Strong problem-solving and analytical skills

Preferred Qualifications

• Knowledge of IC fabrication and packaging

About the Company

Sandisk understands how people and businesses consume data and relentlessly innovates to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world.