Packaging and Assembly Lead

Responsibilities

• Lead NPI process team involving wafer, device packaging, and PCBA assembly optimization
• Communicate with RnD to align design targets with process maturity and yield
• Manage tradeoffs between design and process requirements
• Work with wafer foundries and OSATs to support NPI and volume production
• Provide DFM, DFR, and DFT inputs for device tapeout and packaging
• Develop packaging specifications and maintain inventory tracking
• Audit contract manufacturers and suppliers
• Drive Cp, Cpk, and yield improvement
• Build and grow the Operation Process Team worldwide

Requirements

• Master or Ph.D. degree in Electrical Engineering, Photonics, Mechanical Engineering, Physics, or related field
• Minimum 8 years of relevant experience
• Experience with microelectronic and optical devices packaging
• Proven project management capability
• Experience with process integration and continuous improvement
• Experience working with foundries, OSATs, and PCBA fabs
• Proficiency with FMEA, failure analysis, and 8D reporting

Preferred Qualifications

• Experience with Six Sigma, Lean manufacturing, and SPC
• Familiarity with data analysis software such as JMPs
• Knowledge of wafer level processes (lithography, thin film, plating, DIE/DRIE)
• Understanding of Silicon Photonics and Lidar technologies
• Experience with PCBA processes and supplier quality management

Benefits

• Competitive salary and equity
• Comprehensive medical, dental, and vision coverage
• 401(k) retirement plan
• Flexible vacation and time-off policy

About the Company

Lyte builds perception systems for Physical AI operating in complex environments, combining custom silicon, integrated sensors, and software for robotics and automation.