Package Integration Engineering Senior Engineer

Responsibilities

• Lead and manage NPI activities as a Product Owner, driving the process through NPI Phase Gate Reviews.
• Coordinate new product start-up to achieve first-pass qualification and meet project timelines.
• Collaborate with process, equipment, manufacturing, and planning owners to transition new products into high-volume manufacturing.
• Provide timely support for first silicon, engineering samples, and qualification samples.
• Monitor product yield trends, QDR, and reliability to ensure assembly operations remain in control.
• Own the entire product life cycle from NPI to End of Life (EOL).
• Act as the primary point of contact for TPM on all product-related matters.

Requirements

• Bachelor's or Master's degree in Mechanical, Material, or Chemical Engineering.
• Minimum of 8 years of experience in a multinational semiconductor company, specifically within mobile and automotive sectors.
• Strong expertise in backend engineering processes or package development.
• Technical knowledge of component testing and module manufacturing processes.
• Familiarity with package structures such as BGA and PoP, as well as package reliability concepts.
• Advanced data analysis and statistical analysis skills, with proficiency in JMP analysis being mandatory.
• Ability to make sound, data-driven decisions and prioritize tasks effectively.
• Experience using AI-assisted tools to enhance productivity and root cause screening.

About the Company

Micron Technology is an industry leader in innovative memory and storage solutions. We deliver a rich portfolio of high-performance DRAM, NAND, and NOR products that fuel the data economy, enabling advances in artificial intelligence, 5G, and the intelligent edge.