Module Integration Engineer

Responsibilities

• Execute Front End of Line (FEOL) module setup plans, specifically for Source & Drain (SD) modules, to meet qualification timelines
• Monitor line performance and intervene on off-target SPC excursions to develop process improvement plans
• Lead engineering projects focused on high volume manufacturing (HVM) product qualification, yield ramp-up, and performance targets
• Lead Task Force Teams (TFTs) to resolve systematic challenges related to yield, performance, or reliability
• Perform feasibility studies and design of experiments (DOE) for yield and performance improvement
• Produce technical reports and deliver presentations to internal management and external partners

Requirements

• Master's or PhD in Electrical Engineering, Physics, Materials Science, or a closely related field
• Minimum 8 years of experience with advanced node FinFET or GAA technology
• Extensive FEOL module process integration experience, with a strong preference for GAA Source & Drain module integration
• Deep knowledge of device physics in FinFET or GAA devices
• Proficiency in unit processes including lithography, etch, CMP, diffusion, implant, thin-film deposition, and metrology
• Expertise in Design of Experiments (DOE) and data analysis software such as JMP or Spotfire
• Strong interpersonal and communication skills with the ability to lead cross-functional teams

Benefits

• Medical, dental, and vision insurance
• Life insurance and 401(k) matching with immediate vesting
• Onsite café(s) and workout facilities
• Paid maternity and paternity leave
• Paid time off (PTO) plus regular and personal holidays
• Wellness incentives and performance-based MBO bonuses

About the Company

Samsung Austin Semiconductor is a world leader in advanced semiconductor technology. We are dedicated to innovating today to power the devices of tomorrow, driving excellence in the semiconductor industry through relentless discovery and technological advancement.