Member of Technical Staff, HIG-HBM Layout

Responsibilities

• Lead the design and development of complex Application-Specific Integrated Circuits (ASICs) for High Bandwidth Memories (HBM) used in AI and high-performance computing.
• Establish and grow a premier analog/mixed-signal layout team to meet global HBM requirements.
• Manage team performance, including hiring, development, and retention.
• Oversee multiple custom IC layout projects, managing tasks, resource allocation, and logistics.
• Perform architecture analysis and optimization for performance, power, and area.
• Drive technical excellence in die design, high-speed interface principles, and off-chip signaling.
• Participate in industry standards committees to represent the company and stay ahead of developments.
• Collaborate with multi-functional, multi-site teams across different time zones.

Requirements

• 18+ years of experience in analog/custom layout using advanced CMOS processes.
• 4+ years of experience in team development and project leadership.
• Proven track record of leading multiple projects through successful tape-out.
• Expert-level proficiency with Cadence VLE/VXL and Calibre DRC/LVS.
• Strong technical skills in floor planning and manual routing.
• BE or MTech in Electronic or VLSI Engineering.
• Excellent verbal and written communication skills.

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. For more than 45 years, Micron has redefined innovation with the world’s most advanced memory and semiconductor technologies, enabling advances in artificial intelligence, 5G, and the global data economy.