Manufacturing Technician

Responsibilities

• Process wafers, dies, and packaged components within a cleanroom environment
• Set up, operate, and troubleshoot wire bonding equipment
• Perform wire bonding operations to connect dies to package leads or substrates
• Conduct pull tests to verify bond strength and integrity
• Use microscopes extensively to inspect and manipulate small components
• Perform die attach operations ensuring precise alignment and secure attachment
• Read and interpret technical drawings and process travelers
• Maintain accurate production records and enter process data into computer systems
• Monitor and operate production machinery such as plasma cleaners and ovens
• Identify and report defects or process deviations to ensure quality standards

Requirements

• High School Diploma or GED
• Minimum 2 years of wire bonding experience, including equipment setup and troubleshooting
• Experience using a microscope for inspection or assembly tasks
• Proficiency with Microsoft Windows, Adobe Acrobat Reader, and Outlook
• Strong manual dexterity and hand-eye coordination for handling delicate components
• Ability to work independently with minimal supervision
• Strong verbal and written communication skills in English

Preferred Qualifications

• Previous experience working in a manufacturing or cleanroom environment
• Knowledge of Lean manufacturing principles and 5S workplace organization

About the Company

Microchip Technology Inc. is a leading semiconductor company that designs and manufactures products that power the world around us. With a global team of over 17,000 members, we foster a culture of trust, empowerment, and continuous innovation. We are committed to employee development and provide numerous opportunities for career growth through our nationally recognized leadership programs.