IC Package Engineer

About the Company

Etched is building AI chips that are hard-coded for individual model architectures. Our first product (Sohu) only supports transformers, but has an order of magnitude more throughput and lower latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs.

Responsibilities

• Own the end-to-end package design process, including substrate layout and IC package design
• Leverage advanced packaging technologies like CoWoS and heterogeneous integration
• Manage large-scale BGA design for packages exceeding 4000-ball arrays
• Conduct mechanical and warpage analysis to address coplanarity requirements
• Perform design validation against electrical and mechanical constraints
• Collaborate cross-functionally with chip design, thermal, mechanical, and manufacturing teams
• Oversee package reliability testing including thermal, warpage, shock, and electrical tests

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, or related discipline
• 5+ years of experience in advanced IC package design (CoWoS or equivalent)
• Experience in substrate layout and BGA package design for large ball arrays (>4000 balls)
• Proficiency in package design tools such as Cadence APD/SIP or Mentor Xpedition
• Familiarity with mechanical stress analysis and simulation methodologies
• Experience with advanced packaging nodes (2.5D/3D stacking)
• Knowledge of thermal management techniques in package design

Preferred Qualifications

• Previous experience working in AI, HPC, or semiconductor design companies