HBM SIPI, Staff Engineer

Responsibilities

• Execute signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency-domain and time-domain analysis.
• Conduct mask-based timing analysis using time-domain simulations such as SPICE and ADS.
• Support power integrity and PDN analysis, including impedance modeling and transient response analysis.
• Perform electromagnetic extraction and modeling of signal and power delivery channels across PCB, package, and interposers.
• Automate sign-off processes and collaborate with EDA suppliers to improve tool accuracy and analysis workflows.

Requirements

• 5 years of experience in signal integrity (SI) and power integrity (PI) modeling and analysis.
• Deep understanding of SI/PI, electromagnetic theory, transmission line theory, and I/O design.
• Hands-on experience with circuit simulation tools including Keysight ADS and Synopsys HSPICE.

Preferred Qualifications

• 7+ years of experience in SI/PI and power delivery network (PDN) modeling and analysis.
• Experience with 2.5D/3D advanced packaging (CoWoS, EMIB, interposer-based designs).
• Experience with high-speed interfaces such as DDR, HBM, UCIe, PCIe, and SERDES.
• Proficiency with industry-standard EDA tools including ANSYS HFSS/SIwave and Cadence PowerSI/PowerDC.

Benefits

• Comprehensive medical, dental, and vision plans.
• Robust paid time-off program and paid holidays.
• Income protection programs and paid family leave.
• Additional compensation may include bonuses and equity.

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. Our Heterogeneous Integration Group (HIG) is dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications.