Hardware Reliability Engineer

Responsibilities

• Conduct physics-of-failure modeling for advanced accelerator packaging and assess thermal, mechanical, and electrical stressors
• Lead failure-mode analysis using C-SAM, X-ray CT, SEM, TEM, FIB, and EBSD
• Build and apply models like Coffin-Manson and Arrhenius to predict field lifetime and FIT
• Partner with OSATs to define requirements and ensure JEDEC/IPC/IEEE/MIL-STD compliance
• Assess stress interactions across package, board, and system levels
• Translate package reliability into fleet availability targets including AFR, FIT, and MTBF
• Use AI-assisted/ML tool flows to accelerate failure analysis and lifetime modeling

Requirements

• MS or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, or Applied Physics
• 5+ years in 2.5D/3D advanced packaging reliability
• Deep command of physics-of-failure methodology and materials science
• Proficiency in statistical reliability analysis using JMP, Minitab, or Python
• Hands-on experience with C-SAM, X-ray CT, SEM, TEM, FIB, and EBSD
• Familiarity with JEDEC, IPC, IEEE, and MIL-STD standards
• Experience with heterogeneous integration, chiplet architectures, or HBM
• Knowledge of electrical reliability mechanisms like electromigration and TDDB

About the Company

DensityAI develops advanced AI accelerator silicon and high-performance packaging systems designed for long-term reliability in large-scale data center environments.