Engineer, Package Development Engineering, Package Silicon Integration

Responsibilities

• Support chip-package interaction (CPI) assessments by collecting data and performing basic analysis.
• Assist in investigating wafer dicing, singulation, and integration topics.
• Participate in DFMEA/PFMEA activities by preparing inputs and tracking action items.
• Work with wafer fab, R&D, and manufacturing teams to support yield and quality investigations.
• Support the execution of test vehicles and DOEs, including data collection and report preparation.
• Prepare technical documentation and presentation materials for design reviews and project updates.

Requirements

• Bachelor's or Master's degree in Engineering (Mechanical, Materials Science, Electrical, Chemical, or related).
• Less than 2 years of relevant experience, including internships or research in semiconductor or manufacturing fields.
• Fundamental understanding of semiconductor manufacturing and/or packaging concepts.
• Exposure to structured problem-solving methods such as FMEA and DOE.
• Proficiency in Microsoft Excel, Word, and PowerPoint.
• Strong attention to detail and effective written and verbal communication skills.

About the Company

Micron is an industry leader in innovative memory and storage solutions. We deliver a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products that fuel the data economy and enable advances in artificial intelligence and 5G applications.