Engineer II - Failure Analysis

Responsibilities

• Perform detailed electrical and physical failure analysis for semiconductor products using non-destructive tools such as X-ray, SAM, and optical microscopes.
• Utilize fault isolation techniques including PEM, Thermal Emission/Hotspot Analysis, OBIRCH, and die-level microprobing.
• Execute sample preparation and destructive physical FA techniques, including chemical/laser decapsulation, etching, and mechanical polishing.
• Conduct SEM/EDX analysis and interpret ATE datalog and circuit schematics.
• Generate comprehensive failure analysis reports and provide regular updates and timelines to customers.
• Collaborate with cross-functional teams including Quality, Reliability, Design, Foundry, and Product Engineering to resolve FA cases.
• Develop and implement new failure analysis methods and techniques.
• Mentor FA inspectors, technicians, and junior engineers.

Requirements

• Bachelor or Master degree in Electronics Engineering, Electrical Engineering, or Physics (semiconductor bias preferred).
• Minimum of 2 years of relevant experience in a semiconductor or electronics manufacturing environment.
• Strong knowledge of electrical/electronic circuits and material analysis.
• Proficiency in inspection and analysis tools for both package and die forms.
• Proficiency in MS Office (Word, PowerPoint, Excel).
• Strong interpersonal and communication skills to coordinate across all levels of the organization.

About the Company

Microchip Technology Inc. is a leading global semiconductor company that designs and manufactures microcontrollers, mixed-signal, analog, and Flash-IP solutions. With a team of over 17,000 members, we are dedicated to empowering innovation and providing the technology that powers the world.