Engineer I - Supply

Responsibilities

• Ensure best product quality performance of assembly subcon suppliers through close management and collaboration
• Manage and track supplier assembly performance to meet or exceed set target yield goals
• Analyze subcon assembly performance indices on qualified processes and establish proactive control systems
• Participate in customer and annual quality audits at OSAT
• Investigate internal and customer quality concerns and drive 8D corrective and preventive actions
• Initiate and finalize disposition for non-conforming lots and expired material through SLD and NCRB
• Review specification comparison and gap analysis between Microchip and Assembly Subcon
• Facilitate and review marking FAI and pre-production build requirements and reports
• Support internal Microchip teams regarding assembly subcon related items

Requirements

• BSC Graduate in Engineering (e.g., Material, Electrical, Mechanical, or Electronics)
• At least 5 years of engineering experience in Plastic packages (QFP, QFN, BGA, etc.)
• At least 5 years of experience in Discrete (TO, SOT, etc.) assembly
• Vast experience in assembly processes for Plastic/Discrete IC semiconductors
• Knowledge of assembly process audits
• Strong communication, presentation, and interpersonal skills
• Results-oriented mindset and ability to work effectively in a team

About the Company

Microchip Technology Inc. is a leading provider of smart, connected, and secure embedded control solutions. With a team of over 17,000 members, we design the technology that powers the world. We pride ourselves on a culture of trust, empowerment, and innovation, supported by our nationally-recognized Leadership Passage Programs.