Engineer I, Process Development

Responsibilities

• Develop, optimize, and maintain reflow soldering and flux cleaning processes for SMT and semiconductor assembly operations.
• Monitor and improve key process parameters including reflow temperature profiles, conveyor speed, and atmosphere control.
• Troubleshoot process-related defects such as solder bridging, voiding, non-wet opens, flux residue, and solder balling.
• Perform Design of Experiments (DOE) and root cause analysis to improve yield, quality, and reliability.
• Support new product introduction (NPI), process qualification, and equipment buyoff activities.
• Establish process control plans, SOPs, FMEA, and SPC monitoring for critical parameters.
• Collaborate with production, quality, equipment, and materials teams to resolve manufacturing issues.
• Drive continuous improvement projects focused on cycle time reduction and cost savings.

Requirements

• Experience in SMT reflow soldering optimization and flux cleaning process development.
• Proficiency in performing DOE (Design of Experiments) and root cause analysis.
• Knowledge of SPC monitoring and FMEA methodologies.
• Experience providing NPI (New Product Introduction) support in a manufacturing environment.
• Ability to analyze process data and prepare technical engineering documentation.

About the Company

Analog Devices, Inc. (ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. We combine analog, digital, AI, and software technologies into solutions that combat climate change, connect humans and the world, and drive advancements in automation, robotics, mobility, healthcare, energy, and data centers.