Engineer, HIG HBM, Product Engineering (Media Health Reliability)

Responsibilities

• Define and develop reliability stress test flows and plans to cover all product reliability aspects.
• Work with the Global Quality team to define qualification plans and manage execution progress.
• Drive DPM (Defects Per Million) reduction through optimized manufacturing test flows and strategies.
• Perform root cause analysis for device failures using Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA).
• Provide recommendations for process conversions to improve yield, quality, and reliability for HBM products.
• Manage risks associated with process conversions through close communication with Product Managers.
• Collaborate with cross-functional teams including Fab, HBM Technology Development, Design, and Quality/Reliability.
• Mentor and develop team members while managing technical decision-making and project prioritization.

Requirements

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
• Understanding of CMOS technology, DRAM architecture, and basic device physics.
• Experience with data analysis, statistics, and scripting tools such as Python or JMP.
• Strong problem-solving skills with a focus on identifying root causes.
• Excellent communication skills for articulating technical concepts and findings.
• Ability to work effectively in a team-based, dynamic engineering environment.

Preferred Qualifications

• Experience in semiconductor devices, circuit design, or product validation.

About the Company

Micron Technology, Inc. is an industry leader in innovative memory and storage solutions. We deliver a rich portfolio of high-performance DRAM, NAND, and NOR products that fuel the data economy, enabling advances in artificial intelligence, 5G, and data center technologies.