Engineer, HIG HBM

Responsibilities

• Define and develop reliability stress, test flows, and test plans to cover all product reliability aspects.
• Partner with the Global Quality team to define qualification plans and manage execution progress.
• Drive DPM reduction through optimized manufacturing test flows and test strategies to meet quality, cost, and cycle time KPIs.
• Perform root cause analysis for qualification and RMA device issues using electrical and physical failure analysis (EFA/PFA).
• Provide recommendations for process conversions to improve yield, quality, and performance of HBM products.
• Manage risks associated with process conversions through close communication with Product Managers and Leads.
• Collaborate with cross-functional teams including Fab, HBM Technology Development, Design, and System Development.

Requirements

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
• Understanding of CMOS technology, DRAM architecture, and basic device physics.
• Proficiency in data analysis, statistics, and scripting tools such as Python or JMP.
• Strong problem-solving skills with a focus on identifying root causes.
• Excellent written and spoken English communication skills for articulating technical concepts.
• Ability to work effectively in team-based projects within a dynamic engineering environment.

Preferred Qualifications

• Coursework or internship experience in semiconductor devices, circuit design, or product validation.

About the Company

Micron is an industry leader in innovative memory and storage solutions. We deliver a rich portfolio of high-performance DRAM, NAND, and NOR products that fuel the data economy, enabling advances in artificial intelligence, 5G, and data center technologies.