Engineer, HIG HBM Layout

Responsibilities

• Design and develop critical analog, mixed-signal, custom digital blocks, and full chip level integration.
• Perform layout verification including LVS, DRC, and Antenna checks, ensuring high-quality documentation.
• Ensure on-time delivery of block-level layouts while maintaining strict quality standards.
• Lead project planning, including area/time estimation, scheduling, and delegation to meet milestones.
• Guide and review the work of junior team members on sub-block level layouts.
• Collaborate effectively with global engineering teams to ensure project success.

Requirements

• 2-5 years of experience in memory or custom layout design using advanced CMOS processes (Planar, FinFET).
• Expertise in Cadence VLE/VXL and Mentor Graphic Calibre DRC/LVS.
• Hands-on experience creating layouts for critical blocks such as Temperature sensors, PLL, ADC, DAC, LDO, Bandgap, and Charge Pumps.
• Strong understanding of analog layout fundamentals, including matching, electro-migration, latch-up, coupling, crosstalk, and IR-drop.
• Ability to understand design constraints and the impact of layout on speed, capacitance, power, and area.
• BE or MTech in Electronic or VLSI Engineering.

Preferred Qualifications

• Experience with multiple tape-out support.
• Strong problem-solving skills regarding physical verification of custom layouts.

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. We develop groundbreaking technologies that power the data economy, enabling advances in artificial intelligence, 5G, and high-performance computing.