Engineer, HIG HBM Layout

Responsibilities

• Design and develop critical analog, mixed-signal, and custom digital blocks for High Bandwidth Memory (HBM) applications
• Perform layout verification including LVS, DRC, and Antenna checks, ensuring high-quality documentation
• Manage on-time delivery of block-level layouts and provide full chip level integration support
• Lead project planning, area/time estimation, and scheduling to meet milestones in a multi-project environment
• Guide and review the work of junior team members on sub-block level layouts
• Collaborate with global engineering teams to ensure successful project execution

Requirements

• 3 to 7 years of experience in memory or custom layout design using advanced CMOS processes (Planar, FinFET)
• Expertise in Cadence VLE/VXL and Mentor Graphic Calibre DRC/LVS
• Hands-on experience with critical blocks such as Temperature sensors, PLL, ADC, DAC, LDO, Bandgap, and Charge Pumps
• Strong understanding of analog layout fundamentals, including matching, electromigration, latch-up, crosstalk, and IR-drop
• Ability to understand design constraints and the impact of layout on speed, capacitance, power, and area
• BE or MTech in Electronic or VLSI Engineering

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. We develop groundbreaking technologies that power the data economy, enabling advances in artificial intelligence, 5G, and high-performance computing.