Engineer- HIG HBM, DTPCO

Responsibilities

• Plan and execute bench-level HBM cube tests involving thermal, mechanical, and electrical conditions, including steady-state and transient analysis
• Analyze silicon data to validate hypotheses, support modeling efforts, and aid in yield and performance improvement
• Evaluate system behavior including power/thermal correlation, warpage, stress response, IDD, timing margins, parametric data, and failure signatures
• Support development of system requirements, specifications, and input/output processes to ensure hardware and software compatibility
• Collaborate with cross-functional teams to identify issues, resolve deficiencies, and recommend corrective actions for system-level integration

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering or a related field
• Understanding of electrical, thermal, and mechanical behavior in semiconductor systems
• Experience or exposure to lab-based testing, data analysis, and debugging methodologies
• Ability to analyze system performance, identify issues, and contribute to corrective action planning

Preferred Qualifications

• Exposure to memory systems or High Bandwidth Memory (HBM) architectures
• Familiarity with silicon validation techniques such as parametric testing, timing analysis, or failure analysis
• Experience working with multi-physics testing environments (thermal, stress, electrical)
• Knowledge of system-level modeling or simulation concepts
• Strong communication skills and ability to present findings to multi-functional teams

Benefits

• Choice of medical, dental, and vision plans
• Income protection programs for illness or injury
• Paid family leave
• Robust paid time-off program and paid holidays

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.