Electronic-Photonics IC Mask Data Preparation & GDS Data Integration Engineer

Responsibilities

• Own the complete tape-out flow including Mask GDS/MDP integration, DRC/LVS/ERC verification, and final mask sign-off
• Lead GDS and reticle-to-fab delivery and ensure compliance with fab specifications
• Drive DFM and DFT integration through yield optimization and layout optimization
• Design and integrate special GDS structures including kerf, seal ring, frame, and ESD protection layouts
• Act as the primary interface between mask shops, foundry teams, EDA vendors, and cross-functional internal teams
• Maintain GDS version control and support first-silicon debug and failure analysis

Requirements

• MS or PhD in Electrical Engineering, Physics, or a related field
• 5+ years of experience in semiconductor or photonics tape-out, layout integration, and Mask Data Preparation (MDP)
• Strong expertise in GDSII/OASIS and DRC/LVS/ERC verification flows
• Proficiency with industry-standard tools such as Calibre and Synopsys ICV
• Hands-on experience with production tape-out flows including DFM, DFT, ESD, and RDL layout
• Familiarity with OPC flows for advanced photonics or CMOS nodes

Preferred Qualifications

• Experience with Photonic IC technologies (Si, SiN, etc.) or graphene/2D-material integration
• Experience with photonic/electronic co-design EDA tools such as Cadence EPIC or Lumerical
• Background in mask shops or EDA software environments

About the Company

Black Semiconductor is transforming the semiconductor industry by harnessing the physical properties of graphene to combine electronic computing with photonic communication, creating powerful and energy-efficient networks.