Device Integration Engineer

Responsibilities

• Perform split lot design and DOE analysis to identify key process knobs impacting device performance and yield
• Collaborate with integration and module teams to resolve device-process interactions and define optimization paths
• Lead root cause analysis for device failures and drive corrective actions across fab operations
• Drive Task Force Teams to solve systematic yield, performance, or reliability issues
• Manage Parametric Yield and Wafer Acceptance Electrical Test (WAT) for specific customer accounts
• Conduct Local Layout Effects (LLE) analysis to mitigate transistor performance variability in GAA nanosheet devices
• Lead Material to Hardware Correlation (MHC) task forces to link metrology data to electrical performance

Requirements

• BS in Electrical, Computer, Chemical, or Material Science engineering
• 3-8 years of relevant semiconductor industry experience
• Strong understanding of the interactions between process flows and electrical testing
• Knowledge of unit processes including thin film deposition, etch, diffusion, CMP, and lithography
• Proficiency in electrical device characterization, yield analysis, data mining, DOE, and SPC
• Excellent communication, documentation, and presentation skills

Preferred Qualifications

• Master's or PhD in a related engineering field
• 5+ years of industry experience
• Experience with Spotfire for data analysis
• Experience with SPICE modeling and simulation

Benefits

• Medical, dental, and vision insurance
• Life insurance and 401(k) matching with immediate vesting
• Onsite café(s) and workout facilities
• Paid maternity and paternity leave
• Paid time off (PTO) plus regular and personal holidays
• Wellness incentives and performance-based MBO bonuses

About the Company

Samsung Austin Semiconductor is a world leader in advanced semiconductor technology. At SAS, we are innovating today to power the devices of tomorrow, focusing on excellence in memory, system LSI, foundry, and LED solutions.