Bonding Process & Equipment Engineer

Responsibilities

• Develop, qualify, and optimize wafer-level bonding process technologies, including hybrid and fusion bonding.
• Drive yield improvement, cost reduction, and process capability enhancement (Cpk) through systematic root cause analysis.
• Utilize methodologies such as DOE, FMEA, 8D, and SPC to evaluate defect modes like voids, misalignment, and delamination.
• Collaborate with equipment engineering to qualify bonding grinding and trimming tools and define equipment specifications.
• Support technology transfer and ramp-up across global manufacturing sites while ensuring process baseline consistency.
• Partner with suppliers for technology development, process improvement, and quality auditing.

Requirements

• Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or a related field.
• 7+ years of relevant experience in semiconductor manufacturing or advanced packaging.
• Strong technical knowledge of semiconductor bonding processes (hybrid or fusion bonding preferred).
• Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms.
• Proficiency in data analysis, SPC, and statistical modeling.
• Strong problem-solving skills using structured methodologies like 8D, FMEA, and DOE.

Preferred Qualifications

• Experience with advanced packaging technologies such as HBM or TSV.
• Experience working with EVG, TEL, or Disco equipment platforms.

About the Company

Micron Technology is an industry leader in innovative memory and storage solutions. We deliver a rich portfolio of high-performance DRAM, NAND, and NOR products that fuel the data economy, enabling advances in artificial intelligence, 5G, and cloud computing.