Associate Optical Packaging Engineer

Responsibilities

• Support hands-on manufacturing of fiber-to-chip packaged chip assemblies
• Develop, optimize, and validate optical packaging and active alignment processes
• Assist in process characterization for optical module packaging, including alignment and adhesive curing
• Execute experiments to improve optical coupling efficiency and assembly yield
• Support New Product Introduction (NPI) activities and production readiness
• Troubleshoot manufacturing and reliability issues using structured problem-solving
• Maintain process documentation including work instructions and control plans
• Collaborate with design, manufacturing, test, and reliability engineering teams
• Support equipment setup, calibration, and maintenance for optical assembly
• Analyze process and metrology data to identify yield and quality improvement opportunities

Requirements

• Bachelor’s or Master’s Degree in Engineering, Physics, Materials Science, or related field
• 1–3 years of experience in semiconductor packaging, photonics, optics, or advanced manufacturing
• Basic understanding of optical alignment, fiber optics, and optical measurement techniques
• Exposure to semiconductor assembly or precision alignment systems
• Hands-on laboratory or manufacturing experience with precision assemblies and metrology tools
• Strong problem-solving skills and ability to work in a fast-paced environment

Preferred Qualifications

• Familiarity with photonic integrated circuit (PIC) packaging
• Experience with data analysis tools such as Excel, JMP, MATLAB, or Python
• Understanding of statistical process control (SPC), DOE, or yield analysis

About the Company

PsiQuantum is on a mission to build the first useful quantum computers. Their architecture is based on silicon photonics, leveraging advanced semiconductor manufacturing to build million-qubit, fault-tolerant quantum systems.