AI/HPC Cluster Thermal Design Engineer at AMD - ScoutJobs - The AI-curated global job board
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AMD
Posted 3 hours ago

AI/HPC Cluster Thermal Design Engineer

AMDAI/HPC Cluster Thermal Design Engineer

Requirements

Bachelor's, Master's or Ph.D. in Mechanical Engineering, Fundamentals in heat transfer, thermodynamics, and fluid dynamics, Experience with thermal/CFD simulation tools, Knowledge of electronics cooling concepts

Skills

CFDANSYSMechanical EngineeringHeat Transfer

About the role

Responsibilities

  • Support the thermal design of AI/HPC cluster solutions, including compute racks, cooling loops, and facility interfaces
  • Evaluate cooling architectures such as air cooling, direct liquid cooling, and hybrid approaches
  • Build and refine thermal and airflow models for system, cluster, and data center concepts using industry tools
  • Contribute to flow-network modeling for liquid cooling and coolant distribution analyses
  • Define and execute test plans to validate thermal performance at component, system, and rack levels
  • Support integration of cooling solutions and thermal telemetry in collaboration with cross-functional teams
  • Assist with experimental setup, instrumentation, data collection, and root-cause analysis for thermal issues
  • Create and maintain technical documentation, including design notes, modeling assumptions, and test reports

Requirements

  • Bachelor’s, Master’s, or Ph.D. in Mechanical Engineering with expertise in thermal management of electronics
  • Strong fundamentals in heat transfer, thermodynamics, and fluid dynamics
  • Experience with thermal or CFD simulation tools (e.g., ANSYS, FloTHERM, OpenFOAM, or COMSOL)
  • Knowledge of electronics cooling concepts such as heat sinks, cold plates, and heat exchangers

Preferred Qualifications

  • Exposure to data center thermal concepts like CDU/coolant distribution, rack layouts, or chilled water interfaces
  • Familiarity with measurement and validation practices, including sensor placement and data analysis
  • Understanding of PUE/WUE drivers, economizers, or waste-heat reuse concepts
  • Relevant coursework in two-phase flow, refrigeration, or high-power electronics cooling
  • Previous internship or research experience related to HPC/AI infrastructure

About the Company

AMD is on a mission to build great products that accelerate next-generation computing experiences—from AI and data centers to PCs, gaming, and embedded systems. We push the limits of innovation to solve the world’s most important challenges through a culture of collaboration and excellence.

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AI/HPC Cluster Thermal Design Engineer

AMD · Austin

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