Advanced Packaging Reliability Engineer

About the Company

OpenAI is an AI research and deployment company dedicated to ensuring that general-purpose artificial intelligence benefits all of humanity. The Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads.

Responsibilities

• Lead reliability test plans and assessments for advanced HPC packages, including risk identification and failure-mechanism analysis
• Drive package design optimization based on thermo-mechanical modeling to improve reliability and thermal performance
• Develop and apply package reliability models and lifetime-prediction methodologies
• Evaluate package architectures, structural designs, and materials to maximize robustness
• Predict electromigration lifetime of package interconnects under various operating conditions

Requirements

• 8+ years of industry experience in semiconductor package reliability and failure mechanisms
• In-depth knowledge of advanced packaging architectures (2.5D, 3.5D, chiplets, HBM integration)
• Demonstrated experience leading package failure investigations and root-cause analysis
• Strong experience with thermal and mechanical finite-element modeling (FEM)
• Deep understanding of package-material behavior including CTE, viscoelasticity, and creep

Preferred Qualifications

• Experience developing electromigration or interconnect lifetime models
• Knowledge of package qualification methods and acceleration models
• Familiarity with failure-analysis techniques like SEM, X-ray, and acoustic microscopy
• Experience with high-current power delivery or high-transient-current AI products
• MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or Physics