Advanced Packaging Reliability Engineer

Responsibilities

• Lead reliability test plans and assessments for advanced HPC packages, including risk identification and failure-mechanism analysis.
• Drive package design optimization using thermo-mechanical modeling to improve power integrity, thermal performance, and mechanical robustness.
• Develop and validate package reliability models and lifetime-prediction methodologies for assembly and qualification.
• Evaluate package architectures, structural designs, and materials to maximize manufacturing robustness.
• Predict electromigration lifetime of package interconnects under specific workload and temperature conditions.

Requirements

• 8+ years of industry experience in semiconductor package reliability and failure mechanisms (e.g., solder-joint fatigue, warpage, creep).
• In-depth knowledge of advanced packaging architectures, including 2.5D and 3.5D integration, chiplets, and HBM integration.
• Demonstrated expertise in leading package failure investigations and performing root-cause analysis.
• Strong experience with thermal and mechanical finite-element modeling (FEM) of packages.
• Deep understanding of package-material behavior, including CTE, elasticity, viscoelasticity, and thermal conductivity.

Preferred Qualifications

• Experience developing electromigration or interconnect lifetime models for power-delivery structures.
• Knowledge of package qualification methods, including thermal cycling and power cycling.
• Familiarity with failure-analysis techniques such as X-ray imaging, SEM, and acoustic microscopy.
• MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field.

Benefits

• Medical, dental, and vision insurance with employer HSA contributions.
• 401(k) retirement plan with employer match.
• Flexible PTO and paid parental leave.
• Annual learning and development stipend.
• Daily meals in the office and meal delivery credits.
• Generous equity and performance-related bonuses.

About the Company

OpenAI is an AI research and deployment company dedicated to ensuring that general-purpose artificial intelligence benefits all of humanity. Our Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads, building the next generation of AI-native silicon.