Advanced Packaging Process Technician

Responsibilities

• Perform technical tests and experiments for engineering in the wafer fabrication area
• Test new products and provide technical assistance to process development and engineering personnel
• Interface and communicate with engineering and manufacturing groups to resolve issues
• Provide process and product support to address production concerns and material disposition
• Identify and resolve multiple priority issues to improve fab performance
• Support the engineering organization by learning and understanding process flow quickly

Requirements

• Experience with Flip Chip Bonding, flux dispense, and underfill dispense
• Experience with profilometry and optical microscope inspection
• Proficiency with MS Office, Word, and Excel
• Ability to work in a clean room environment
• Strong attention to detail and collaborative skills

Preferred Qualifications

• AA degree or 4 years of experience in a cleanroom fab
• Experience with probe stations and electrical testing
• Experience operating lasers and following related safety protocols

About the Company

Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications, targeting High-Performance Computing, Cloud computing, autonomous vehicles, and aerospace.