Advanced Packaging Engineer

Responsibilities

• Own different aspects of Packaging including Design Layout, SI/PI and thermo-mechanical aspects
• Use and develop AI-assisted tool flows to accelerate package design and signoff timelines
• Work with chip-design and software teams driving the AI accelerator program from first silicon through scale-out

Requirements

• 10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies
• Exceptional abilities across the full advanced packaging design and tradeoffs
• Hands-on with industry-standard packaging tools and flows for multi-die packaging (including 2.5D/3D)
• Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions

Preferred Qualifications

• DFT-aware packaging design, RTL and PD flows

Benefits

• Equity grant per company guidelines
• Medical, dental, and vision insurance
• 401(k)
• Standard PTO
• Visa sponsorship available (H-1B, O-1, TN, E-3, etc.)